• Standard test – visual inspection (SIP):
  optical inspection of the assembly according to IPC standard A610
• AOI option:
  Normally, this test options only makes sense for the assessment of serial production feasibility.
• X-ray option:
  This option makes sense in individual cases for assessment of solder joints for BGA components (void portion).
• Flying Probe option:
  This testing option requires a high level of programming effort for the test program and significantly lengthens throughput time.
• DfM analysis option:
  We can examine your layout in regard to manufacturing optimization upon request.
• DfT analysis option:
  We can examine your layout in regard to test coverage in serial production upon request. 
• Layout services option:
  Our layout department is happy to offer you layout service upon request.
• Obsolescence Management option:
  Upon request we can examine your BOM in regard to component maturity to reduce the risk of changes and discontinuations.

Please note: Additional test options cause supplemental costs and typically extend delivery times (depending on the complexity of the assembly).